View TEA1098_130629.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

INTEGRATED CIRCUITS
DATA SHEET
TEA1098 Speech and handsfree IC
Product specification Supersedes data of 1999 May 20 File under Integrated Circuits, IC03 1999 Oct 14
Philips Semiconductors
Product specification
Speech and handsfree IC
FEATURES Line interface * Low DC line voltage * Voltage regulator with adjustable DC voltage * Symmetrical high impedance inputs (70 k) for dynamic, magnetic or electret microphones * DTMF input with confidence tone on earphone and/or loudspeaker * Receive amplifier for dynamic, magnetic or piezo-electric earpieces (with externally adjustable gain) * Automatic Gain Control (AGC) for true line loss compensation. Supplies * Provides a strong 3.35 V regulated supply for microcontrollers or diallers * Provides filtered power supply, optimized according to line current * Filtered 2.0 V power supply output for electret microphone * PD logic input for power-down. Handsfree * Asymmetrical high input impedance for electret microphone * Loudspeaker amplifier with single-ended rail-to-rail output and externally adjustable gain ORDERING INFORMATION TYPE NUMBER TEA1098TV TEA1098H TEA1098UH PACKAGE NAME VSO40 QFP44 - DESCRIPTION plastic very small outline package; 40 leads plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm bare die; on foil
TEA1098
* Dynamic limiter on loudspeaker amplifier to prevent distortion * Logarithmic volume control on loudspeaker amplifier via linear potentiometer * Duplex controller consisting of: - Signal and noise envelope monitors for both channels (with adjustable sensitivities and timing) - Decision logic (with adjustable switch-over and Idle mode timing) - Voice switch control (with adjustable switching range and constant sum of gain during switching). APPLICATIONS * Line powered telephone sets. GENERAL DESCRIPTION The TEA1098 is an analog bipolar circuit dedicated to telephony applications. It includes a line interface, handset (HS) microphone and earpiece amplifiers, handsfree (HF) microphone and loudspeaker amplifiers and a duplex controller with signal and noise monitors on both channels. This IC provides a 3.35 V supply for a microcontroller or dialler and a 2.0 V filtered voltage supply for an electret microphone.
VERSION SOT158-1 SOT307-2 -
1999 Oct 14
2
Philips Semiconductors
Product specification
Speech and handsfree IC
TEA1098
QUICK REFERENCE DATA Iline = 15 mA; RSLPE = 20 ; Zline = 600 ; f = 1 kHz; Tamb = 25 C for TEA1098H and TEA1098TV; Tj = 25 C for TEA1098UH; AGC pin connected to LN; PD = HIGH; HFC = LOW; MUTE = HIGH; measured according to test circuits; unless otherwise specified. SYMBOL Iline VSLPE VBB VDD IBB IBB(pd) Gv(MIC-LN) Gv(IR-RECO) Gv(QR) PARAMETER line current operating range stabilized voltage between SLPE and GND regulated supply voltage for internal circuitry regulated supply voltage on pin VDD current available on pin VBB current consumption on VBB during power-down phase voltage gain from pin MIC+/MIC- to LN voltage gain from pin IR (referenced to LN) to RECO gain voltage range between pins RECO and QR VTXIN = 3 mV (RMS); RGATX = 30.1 k VHFTX = 15 mV (RMS) VHFRX = 30 mV (RMS); RGALS = 255 k; Iline = 70 mA with RSWR referenced to 365 k CONDITIONS normal operation with reduced performance Iline = 15 mA Iline = 70 mA Iline = 15 mA Iline = 70 mA VBB > 3.35 V + 0.25 V (typ.) otherwise in speech mode in handsfree mode PD = LOW VMIC = 5 mV (RMS) VIR = 8 mV (RMS) MIN. 11 1 3.4 5.7 2.75 4.9 3.1 - - - - 43.3 28.7 -3 12.7 33.5 25.5 - -40 5.45 - - 3.7 6.1 3.0 5.3 3.35 11 9 460 44.3 29.7 - 15.2 34.7 28 40 - 6.45 TYP. MAX. UNIT 130 11 4.0 6.5 3.25 5.7 3.6 - - - 45.3 30.7 +15 17.7 35.9 30.5 - +12 7.45 mA mA V V V V V V mA mA A dB dB dB dB dB dB dB dB dB
VBB - 0.25 -
Gv(TXIN-TXOUT) voltage gain from pin TXIN to TXOUT Gv(HFTX-LN) voltage gain from pin HFTX to LN Gv(HFRX-LSAO) voltage gain from pin HFRX to LSAO SWRA SWRA Gv(trx) switching range switching range adjustment
gain control range for transmit and Iline = 70 mA receive amplifiers affected by the AGC; with respect to Iline = 15 mA
1999 Oct 14
3
Philips Semiconductors
Product specification
Speech and handsfree IC
BLOCK DIAGRAM
REG LN 18 (15) 19 (16) STARTER SLPE 17 (14)
TEA1098
(10) 13 VBB
R1 (19) 22 VDD LINE CURRENT DETECTION LOW VOLTAGE BEHAVIOUR SWITCH SUPPLY MANAGEMENT (20) 23 MICS
AGC 21 (18)
AGC
POWER-DOWN CURRENT SOURCES
(38) 1 PD
GND 16 (13)
Tail currents for preamps
HFTX 39 (36)
TEA1098
DTMF 35 (32) MIC+ 34 (31) MIC- 33 (30) ATTENUATOR
LOGIC INPUTS DECODING
(37) 40 HFC (39) 2 MUTE
(27) 30 GATX (26) 29 TXOUT
TXIN 31 (28)
(29) 32 GNDTX
(24) 27 SWT TSEN 8 (4) TENV 7 (3) TNOI 6 (2) RNOI 9 (5) RENV 11 (7) RSEN 10 (6) VOLUME CONTROL GALS 14 (11) LSAO 15 (12) (23) 26 VOL TX AND RX ENVELOPE AND NOISE DETECTORS BUFFERS AND COMPARATORS (21) 24 STAB DUCO LOGIC SWT STATUS VOICE SWITCH (22) 25 SWR (25) 28 IDT
(1) 5 HFRX
DLC 12 (8)
DYNAMIC LIMITER (17) 20 IR
RECO 38 (35) GARX 37 (34) QR 36 (33) ATTENUATOR
MGL317
Pin numbers in parenthesis apply to the TEA1098H. Pin numbers not in parenthesis apply to the TEA1098TV.
Fig.1 Block diagram.
1999 Oct 14
4
Philips Semiconductors
Product specification
Speech and handsfree IC
PINNING PIN SYMBOL TEA1098TV PD MUTE n.c. n.c. n.c. n.c. n.c. HFRX TNOI TENV TSEN RNOI RSEN RENV DLC n.c. VBB GALS LSAO GND SLPE LN REG IR AGC VDD MICS STAB SWR VOL SWT IDT TXOUT GATX TXIN GNDTX MIC- MIC+ 1 2 3 4 - - - 5 6 7 8 9 10 11 12 - 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 TEA1098H 38 39 40 41 42 43 44 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 TEA1098UH 41 42 43 44 45 46 47 1 2 3 4 5 6 7 8 9 and 13 10 11 12 14 and 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 to 32 33 34 power-down input (active LOW) logic input (active LOW) not connected not connected not connected not connected not connected receive input for loudspeaker amplifier transmit noise envelope timing adjustment PAD DESCRIPTION
TEA1098
transmit signal envelope timing adjustment transmit signal envelope sensitivity adjustment receive noise envelope timing adjustment receive signal envelope sensitivity adjustment receive signal envelope timing adjustment dynamic limiter capacitor for the loudspeaker amplifier not connected stabilized supply for internal circuitry loudspeaker amplifier gain adjustment loudspeaker amplifier output ground reference line current sense positive line terminal line voltage regulator decoupling receive amplifier input automatic gain control/line loss compensation 3.35 V regulated voltage supply for microcontrollers microphone supply reference current adjustment switching range adjustment loudspeaker volume adjustment switch-over timing adjustment Idle mode timing adjustment HF microphone amplifier output HF microphone amplifier gain adjustment HF microphone amplifier input ground reference for microphone amplifiers negative HS microphone amplifier input positive HS microphone amplifier input
1999 Oct 14
5
Philips Semiconductors
Product specification
Speech and handsfree IC
TEA1098
PIN SYMBOL TEA1098TV DTMF QR GARX RECO HFTX HFC 35 36 37 38 39 40 TEA1098H 32 33 34 35 36 37
PAD DESCRIPTION TEA1098UH 35 36 37 38 39 40 dual tone multi-frequency input earpiece amplifier output earpiece amplifier gain adjustment receive amplifier output transmit input for line amplifier logic input
handbook, halfpage
PD 1 MUTE 2 n.c. 3 n.c. 4 HFRX 5 TNOI 6 TENV 7 TSEN 8 RNOI 9 RSEN 10
40 HFC 39 HFTX 38 RECO 37 GARX 36 QR 35 DTMF 34 MIC+ 33 MIC- 32 GNDTX 31 TXIN
TEA1098TV
RENV 11 DLC 12 VBB 13 GALS 14 LSAO 15 GND 16 SLPE 17 LN 18 REG 19 IR 20
MGL341
30 GATX 29 TXOUT 28 IDT 27 SWT 26 VOL 25 SWR 24 STAB 23 MICS 22 VDD 21 AGC
Fig.2 Pin configuration (TEA1098TV).
1999 Oct 14
6
Philips Semiconductors
Product specification
Speech and handsfree IC
TEA1098
35 RECO
37 HFC
handbook, full pagewidth
34 GARX
39 MUTE
36 HFTX
41 n.c.
44 n.c.
40 n.c.
42 n.c.
43 n.c.
38 PD
HFRX 1 TNOI 2 TENV 3 TSEN 4 RNOI 5 RSEN 6 RENV 7 DLC 8 n.c. 9 VBB 10 GALS 11
33 QR 32 DTMF 31 MIC+ 30 MIC- 29 GNDTX
TEA1098H
28 TXIN 27 GATX 26 TXOUT 25 IDT 24 SWT 23 VOL
STAB 21
LSAO 12
GND 13
SLPE 14
MICS 20
SWR 22
LN 15
REG 16
IR 17
AGC 18
VDD 19
FCA020
Fig.3 Pin configuration (TEA1098H).
FUNCTIONAL DESCRIPTION All data values given in this chapter are typical, except when otherwise specified. Supplies LINE INTERFACE AND INTERNAL SUPPLY (PINS LN, SLPE, REG AND VBB) The supply for the TEA1098 and its peripherals is obtained from the line. The IC generates a stabilized reference voltage (Vref) between pins SLPE and GND. This reference voltage is equal to 3.7 V for line currents below 18 mA. When the line current rises above 45 mA, the reference voltage rises linearly to 6.1 V. For line currents below 9 mA, Vref is automatically adjusted to a lower value. The performance of the TEA1098 in this so-called low voltage area is limited (see Section "Low voltage behaviour"). The reference voltage is temperature compensated.
The voltage between pins SLPE and REG is used by the internal regulator to generate the stabilized reference voltage and is decoupled by a capacitor connected between pins LN and REG. This capacitor, converted into an equivalent inductance realizes the set impedance conversion from its DC value (RSLPE) to its AC value (done by an external impedance). The IC regulates the line voltage at pin LN which can be calculated as follows: V LN = V ref + R SLPE x I SLPE I SLPE = I line - I where: Iline = line current. Ix = current consumed on pin LN (approximately a few A). ISLPE = current flowing through the RSLPE resistor.
x
1999 Oct 14
7
Philips Semiconductors
Product specification
Speech and handsfree IC
The preferred value for RSLPE is 20 . Changing this value not only affects the DC characteristics, it also influences the transmit gains to the line, the gain control characteristic, the sidetone level, and the maximum output swing on the line. Figure 4 shows that the internal circuit is supplied by pin VBB, which combined with the line interface is a strong supply point. The line current through resistor RSLPE is sunk by the VBB voltage stabilizer, and is suitable for supplying a loudspeaker amplifier or any peripheral IC. Voltage VBB is 3.0 V at line currents below 18 mA and rises linearly to 5.3 V when the line current rises above 45 mA. It is temperature compensated.
TEA1098
The current switch TR1-TR2 is intended to reduce distortion of large AC line signals. Current ISLPE is supplied to VBB via TR1 when the voltage on pin SLPE is above VBB + 0.25 V. When the voltage on pin SLPE is below this value, ISLPE is shunted to GND via TR2. Voltage Vref can be increased by connecting an external resistor between pins REG and SLPE. For large line currents, this increase can slightly affect some dynamic performances such as maximum signal level on the line at 2% Total Harmonic Distortion (THD). The external resistor does not affect the voltage on pin VBB; see Fig.5 for the main DC voltages.
LN handbook, full pagewidth RSLPE 20 SLPE CREG 4.7 F E1 D1 J1 R3 REG R1 TR1
TR2 GND VBB E2
TP1
D1 TN2
R2 from preamp TN1 GND GND J2
MGM298
Fig.4 Line interface principle.
1999 Oct 14
8
Philips Semiconductors
Product specification
Speech and handsfree IC
TEA1098
handbook, full pagewidth
8
FCA049
LN
voltages (V) SLPE 6 VBB
4 VDD
2
MICS
0 0 0.01 0.02 0.03 0.04 0.05 0.06 Iline (A) 0.07
Fig.5 Main DC voltages.
VDD SUPPLY FOR MICROCONTROLLERS (PIN VDD) The voltage on the VDD supply point follows the voltage on VBB with a difference typically of 250 mV, internally limited to 3.35 V. This voltage is temperature compensated. This supply point can provide a current of up to typically 3 mA. Its internal consumption stays low (a few 10 nA) as long as VDD does not exceed 1.5 V (see Fig.6). An external voltage can be connected to VDD with limited extra consumption on VDD (typically 100 A). This voltage source should not be below 3.5 V or above 6 V. VBB and VDD can supply current to external circuits within the line limits, taking into account the internal current consumption. SUPPLY FOR MICROPHONE (PINS MICS AND GNDTX) The MICS output can be used as a supply for an electret microphone. Its voltage is equal to 2.0 V; it can source a current of up to 1 mA and has an output impedance equal to 200 .
LOW VOLTAGE BEHAVIOUR For line currents below 9 mA, the reference voltage is automatically adjusted to a lower value; the VBB voltage follows the SLPE voltage with a difference of 250 mV. Any excess current available, other than for the purposes of DC biasing the IC, will be small. At low reference voltage, the IC has limited performance. When voltage VBB falls below 2.7 V, it is detected by the receive dynamic limiter circuit connected to pin LSAO and is continuously activated, discharging the capacitor connected to pin DLC. In the DC condition, the loudspeaker is then automatically disabled below this voltage. When VBB falls below 2.5 V, the TEA1098 is forced into a low voltage mode irrespective of the logic input levels. This is a speech mode with reduced performance which only enables the microphone channel (between the MIC inputs and pin LN) and the earpiece amplifier. These two channels are able to deliver signals for line currents as small as 3 mA. The HFC input is tied to GND sinking a current of typically 300 A.
1999 Oct 14
9
Philips Semiconductors
Product specification
Speech and handsfree IC
TEA1098
10 8 handbook, full pagewidth IDD (pA) 10 7
FCA050
10 6
10 5
10 4
10 3
10 2
10 1.0
1.5
2.0
2.5
VDD (V)
3.0
Fig.6 Current consumption on VDD.
POWER-DOWN MODE (PIN PD) To reduce consumption during dialling or register recall (flash), the TEA1098 is provided with a power-down input (PD). When the voltage on pin PD is LOW, the current consumption from VBB and VDD is reduced to typically 460 A. Therefore a capacitor of 470 F on VBB is sufficient to power the TEA1098 during pulse dialling or flash. The PD input has a pull-up structure. In this mode, the capacitor CREG is internally disconnected. Transmit channels (pins MIC+, MIC-, DTMF, HFTX and LN) HANDSET MICROPHONE AMPLIFIER (PINS MIC+, MIC- AND LN) The TEA1098 has symmetrical microphone inputs. The input impedance between pins MIC+ and MIC- is typically 70 k. The voltage gain between pins MIC+/MIC- and LN is set to 44.3 dB. Without output limitation, the microphone input stage can accept signals of up to 18 mV (RMS) at 2% THD (room temperature).
The microphone inputs are biased at a voltage of one diode. Automatic gain control is provided for line loss compensation. DTMF AMPLIFIER (PINS DTMF, LN AND RECO) The TEA1098 has an asymmetrical DTMF input. The input impedance between DTMF and GND is typically 20 k. The voltage gain between pins DTMF and LN is set to 25.35 dB. Without output limitation, the input stage can accept signals of up to 180 mV (RMS) at 2% THD (room temperature). When the DTMF amplifier is enabled, dialling tones may be sent on the line. These tones can be heard in the earpiece or in the loudspeaker at a low level. This is called the confidence tone. The voltage attenuation between pins DTMF and RECO is typically -16.5 dB. This input is DC biased at 0 V. The automatic gain control has no effect on these channels. 10
1999 Oct 14
Philips Semiconductors
Product specification
Speech and handsfree IC
HANDSFREE TRANSMIT AMPLIFIER (PINS HFTX AND LN) The TEA1098 has an asymmetrical HFTX input, which is mainly intended for use in combination with the TXOUT output. The input impedance between HFTX and GND is typically 20 k. The voltage gain between pins HFTX and LN is set to 34.7 dB. Without output limitation, the input stage can accept signals of up to 95 mV (RMS) at 2% THD (room temperature). The HFTX input is biased at a voltage of two diodes. Automatic gain control is provided for line loss compensation. Receive channels (pins IR, RECO, GARX and QR) RX AMPLIFIER (PINS IR AND RECO) The receive amplifier has one input (IR) which is referenced to the line. The input impedance between pins IR and LN is typically 20 k and the DC bias between these pins is equal to the voltage of one diode. The gain between pins IR (referenced to LN) and RECO is typically 29.7 dB. Without output limitation, the input stage can accept signals of up to 50 mV (RMS) at 2% THD (room temperature). The receive amplifier has a rail-to-rail output (RECO), which is designed for use with high ohmic (real) loads of more than 5 k. This output is biased at a voltage of two diodes. Automatic gain control is provided for line loss compensation. EARPIECE AMPLIFIER (PINS GARX AND QR) The earpiece amplifier is an operational amplifier which has an output (QR) and an inverting input (GARX). Its input signal is fed by a decoupling capacitor from the receive amplifier output (RECO) to two resistors which set the required gain or attenuation from -3 to +15 dB compared to the receive gain. Two external capacitors CGAR (connected between GAR and QR) and CGARS (connected between GAR and GND) ensure stability. The CGAR capacitor provides a first-order low-pass filter. The cut-off frequency corresponds to the time constant CGAR x Re2. The relationship CGARS 10 x CGAR must be satisfied. The earpiece amplifier has a rail-to-rail output (QR) biased at a voltage of two diodes. It is designed for use with low ohmic (real) loads of 150 , or capacitive loads of 100 nF in series with 100 . AGC (pin AGC)
TEA1098
The TEA1098 performs automatic line loss compensation, which fits well with the true line attenuation. The automatic gain control varies the gain of some transmit and receive amplifiers in accordance with the DC line current. The control range is 6.45 dB for Gv(MIC-LN) and Gv(IR-RECO), and 6.8 dB for Gv(HFTX-LN), which corresponds approximately to a line length of 5.5 km for a 0.5 mm twisted-pair copper cable. To enable this gain control, the pin AGC must be shorted to pin LN. The start current for compensation corresponds to a line current of typically 23 mA and a stop current of 57 mA. The start current can be increased by connecting an external resistor between pins AGC and LN. It can be increased by up to 40 mA (using a resistor of typically 80 k). The start and stop current will be maintained at a ratio of 2.5. By leaving the AGC pin open, the gain control is disabled and no line loss compensation occurs. Handsfree application Figure 7 shows a loop is formed by the sidetone network in the line interface section, and by the acoustic coupling between loudspeaker and microphone in the handsfree section. A loop-gain of greater than 1 causes howl. To prevent howl in full duplex applications, the loop-gain must be set much lower than 1. This is achieved by the duplex controller which detects the channel with the `largest' signal and controls the gains of the microphone and the loudspeaker amplifiers so that the sum of their gains remains constant. Therefore in the handsfree application, the circuit can have three stable modes: 1. Transmit mode (Tx mode). The microphone amplifier is at maximum gain, and the loudspeaker amplifier is at minimum gain. 2. Receive mode (Rx mode). The microphone amplifier is at minimum gain, and the loudspeaker amplifier is at maximum gain. 3. Idle mode. The microphone amplifier and the loudspeaker amplifier are both midway between maximum and minimum gain. The difference between the maximum and minimum gain is called the switching range.
1999 Oct 14
11
Philips Semiconductors
Product specification
Speech and handsfree IC
TEA1098
handbook, full pagewidth
acoustic coupling
telephone line
HYBRID
DUPLEX CONTROL
sidetone
MGM299
Fig.7 Handsfree telephone set principles.
HANDSFREE MICROPHONE CHANNEL: PINS TXIN, GATX, TXOUT AND GNDTX (see Fig.8) The TEA1098 has an asymmetrical handsfree microphone input (TXIN) with an input resistance of 20 k. The input DC bias is 0 V. The gain of the input stage varies according to the TEA1098 mode. In Tx mode, it has maximum gain; in Rx mode, it has minimum gain, and in Idle mode, it is midway between maximum and minimum gain.
Switch-over from one mode to the other is smooth and click-free. The output (TXOUT) is biased at a voltage of two diodes and has a current capability of 20 A (RMS). In Tx mode, the overall gain of the microphone amplifier (from pins TXIN to TXOUT) can be adjusted from 0 up to 31 dB to suit specific application requirements. The gain is proportional to the value of RGATX and equals 15.2 dB when RGATX is 30.1 k. Without output limitation, the microphone input stage can accept signals of up to 18 mV (RMS) at 2% THD (room temperature).
handbook, full pagewidth
VBB RMIC CMIC 31 TXIN (28) V I I V
GATX
30 (27)
RGATX
TXOUT
29 (26)
to envelope detector
from voice switch
GNDTX
32 (29)
MGL342
Pin numbers in parenthesis apply to the TEA1098H. Pin numbers not in parenthesis apply to the TEA1098TV.
Fig.8 Handsfree microphone channel.
1999 Oct 14
12
Philips Semiconductors
Product specification
Speech and handsfree IC
LOUDSPEAKER CHANNEL
TEA1098
In Rx mode, the overall gain of the loudspeaker amplifier can be adjusted from 0 up to 35 dB to suit specific application requirements. The gain from pin HFRX to pin LSAO is proportional to the value of RGALS and is 28 dB when RGALS is 255 k. It is recommended that a capacitor is connected in parallel with RGALS to provide a first-order low-pass filter.
Loudspeaker amplifier: pins HFRX, GALS and LSAO
The TEA1098 loudspeaker amplifier has an asymmetrical input with an input resistance of 20 k between pins HFRX and GND. It is biased at a voltage of two diodes. Without output limitation, the input stage can accept signals of up to 580 mV (RMS) at 2% THD (room temperature). The gain of the input stage varies according to the TEA1098 mode. In Rx mode, it has maximum gain; in Tx mode, it has minimum gain and in Idle mode, it is halfway between maximum and minimum gain. Switch-over from one mode to the other is smooth and click-free. The rail-to-rail output stage is designed to power a loudspeaker connected as a single-ended load (between pins LSAO and GND).
Volume control: pin VOL
The loudspeaker amplifier gain can be adjusted by the potentiometer RVOL. For logarithmic gain control, a linear potentiometer can be used. Each 1.9 k increase of RVOL results in a gain loss of 3 dB. The maximum gain reduction using the volume control is internally limited to the switching range (see Fig.9).
handbook, full pagewidth
RGALS
to logic 14 GALS (11) VBB 15 LSAO (12) V I
to/from voice switch
to envelope detector
CGALS CLSAO
I
V
HFRX 5 (1) VOLUME CONTROL VOL 26 (23) R VOL
12 DLC (8) CDLC
DYNAMIC LIMITER
MGL343
Pin numbers in parenthesis apply to the TEA1098H. Pin numbers not in parenthesis apply to the TEA1098TV.
Fig.9 Loudspeaker channel.
Dynamic limiter: pin DLC
The TEA1098 dynamic limiter prevents clipping of the loudspeaker output stage and protects the operation of the circuit when the supply voltage at VBB falls below 2.7 V. Hard clipping of the loudspeaker output stage is prevented by rapidly reducing the gain when the output stage starts to saturate. The time taken to effect gain reduction (clipping attack time) is approximately a few milliseconds. The circuit stays in the reduced gain mode until the peaks of the loudspeaker signals no longer cause saturation. The gain of the loudspeaker amplifier then returns to its normal value within the clipping release time (typically
250 ms). Both attack and release times are proportional to the value of the capacitor CDLC. The total harmonic distortion of the loudspeaker output stage, in reduced gain mode, stays below 2% up to 10 dB (minimum) of input voltage overdrive [providing VHFRX is below 580 mV (RMS)]. When the supply voltage falls below an internal threshold voltage of 2.7 V, the gain of the loudspeaker amplifier is reduced rapidly (approximately 1 ms). When the supply voltage rises above 2.7 V, the gain of the loudspeaker amplifier is increased. By forcing a level lower than 0.2 V on pin DLC, the loudspeaker amplifier is muted and the TEA1098 is automatically forced into the Tx mode. 13
1999 Oct 14
Philips Semiconductors
Product specification
Speech and handsfree IC
DUPLEX CONTROLLER
TEA1098
In the basic application, (see Fig.19), it is assumed that VTXIN = 1 mV (RMS) and VHFRX = 100 mV (RMS) nominal and RTSEN and RRSEN both have a value of 10 k. When capacitors CTSEN and CRSEN both have a value of 100 nF, the cut-off frequency is at 160 Hz. The buffer amplifiers feeding the compressed signals to pins TENV and RENV have a maximum source current of 120 A and a maximum sink current of 1 A. Capacitors CTENV and CRENV set the timing of both signal envelope detectors. In the basic application, the value of both capacitors is 470 nF. Because of the logarithmic compression, each 6 dB signal increase means an 18 mV increase on the signal envelopes at pins TENV or RENV (room temperature). Thus, timings can be expressed in dB/ms. At room temperature, the 120 A sourced current corresponds to a maximum signal envelope rise-slope of 85 dB/ms, which is sufficient to track normal speech signals. The 1 A current sunk by pin TENV or pin RENV corresponds to a maximum fall-slope of 0.7 dB/ms. This is sufficient for a smooth envelope and also eliminates the effect of echoes on switching behaviour.
Signal and noise envelope detectors: pins TSEN, TENV, TNOI, RSEN, RENV and RNOI
The strength of signal level and background noise in both channels is monitored by signal envelope detectors and noise envelope detectors respectively. The outputs of the envelope detectors provide inputs to the decision logic. The signal and noise envelope detectors are shown in Fig.10. For the transmit channel, the signal between pin TXIN and pin TSEN is amplified by 40 dB. For the receive channel, the signal between pin HFRX and pin RSEN is amplified by 0 dB. The signals between pin TSEN and pin TENV, and between pin RSEN and pin RENV are logarithmically compressed and buffered. The sensitivity of the envelope detectors is set by resistors RTSEN and RRSEN. The capacitors connected in series with these two resistors block any DC component and form a first-order high-pass filter.
handbook, full pagewidth
DUPLEX CONTROLLER to logic LOG from microphone amplifier from loudspeaker amplifier LOG to logic
TSEN 8 (4) RTSEN CTSEN
TENV 7 (3)
TNOI 6 (2)
RSEN 10 (6) RRSEN
RENV 11 (7)
RNOI 9 (5)
CTENV
CTNOI
CRSEN
CRENV
CRNOI
MGL344
Pin numbers in parenthesis apply to the TEA1098H. Pin numbers not in parenthesis apply to the TEA1098TV.
Fig.10 Signal and noise envelope detectors.
1999 Oct 14
14
Philips Semiconductors
Product specification
Speech and handsfree IC
To determine the noise level, the signals between pin TENV and pin TNOI, and between pin RENV and pin RNOI are buffered. The buffers have a maximum source current of 1 A and a maximum sink current of 120 A. Capacitors CTNOI and CRNOI set the timing of both noise envelope detectors. In the basic application, see Fig.19, the value of both capacitors is 4.7 F. At room temperature, the 1 A sourced current corresponds to a maximum noise envelope rise-slope of approximately 0.07 dB/ms which is small enough to track background noise without being affected by speech bursts.
TEA1098
The 120 A sink current corresponds to a maximum fall-slope of approximately 8.5 dB/ms. However, because the noise envelope tracks the fall of the signal envelope, it will never fall faster than approximately 0.7 dB/ms. The behaviour of the signal envelope and noise envelope detectors is illustrated in Fig.11.
handbook, full pagewidth
4 mV (RMS) 1 mV (RMS)
MBG354
INPUT SIGNAL
SIGNAL ENVELOPE A A: 85 dB/ms B: 0.7 dB/ms 36 mV B A B
NOISE ENVELOPE C B: 0.7 dB/ms C: 0.07 dB/ms 36 mV B C B
time
Fig.11 Signal and noise envelope waveforms. VENV - VNOI = 13 mV. This so called speech/noise threshold is implemented in both channels. The signal on pin TXIN contains both speech and the acoustically coupled signal from the loudspeaker. In Rx mode, the loudspeaker signal overrides the speech. Therefore, the signal envelope on pin TENV consists mainly of the loudspeaker signal. To correct this, an attenuator is connected between pin TENV and the TENV/RENV comparator. Its attenuation is equal to that applied to the microphone amplifier.
Decision logic: pins IDT and SWT
The TEA1098 selects its mode of operation (Tx, Rx or Idle) by comparing the signal and noise envelopes of both channels. This is executed by the decision logic. The resulting voltage on pin SWT is the input to the voice switch. To facilitate the distinction between signal and noise, the signal is considered as speech when its envelope is more than 4.3 dB above the noise envelope. At room temperature, this is equal to a voltage difference of 1999 Oct 14 15
Philips Semiconductors
Product specification
Speech and handsfree IC
When a dial tone is present on the line, without monitoring, it would be recognized as noise because it has a constant amplitude. This would cause the TEA1098 to go into Idle mode, and the user would hear the dial tone fade away. To prevent this, a dial tone detector monitors input signals between pins HFRX and GND. In standard applications, the detector does not consider a signal level above 25 mV (RMS) to be noise. This level is proportional to the value of RRSEN. Similarly, a transmit detector monitors input signals between pins TXIN and GNDTX. In standard applications the detector does not consider a signal level above 0.75 mV (RMS) to be noise. This level is proportional to the value of RTSEN.
TEA1098
Figure 12 shows that the output of the decision logic is a current source. The logic table shows the relationship between the input levels and the value of the current source. The current source can charge or discharge the capacitor CSWT at a switch-over current of 10 A. If the current is zero, the voltage on pin SWT becomes equal to the voltage on pin IDT via the high-ohmic resistor RIDT (idling). The resulting voltage difference between pins SWT and IDT can vary between -400 and +400 mV and determines the TEA1098 mode (see Table 1).
handbook, full pagewidth
IDT 28 (25) DUPLEX CONTROLLER Vref (3) 7 TENV (2) 6 TNOI 13 mV
ATTENUATOR
LOGIC(1)
RIDT
SWT 27 (24)
CSWT X (7) 11 RENV (5) 9 RNOI 13 mV X 0 X 0 1 0 0 X 0 0 X 1 X 1 X 1 0 0 1 X X -10 A +10 A +10 A
Vdt from logic from dynamic limiter
MGL345
(1) When DLC < 0.2 V, -10 A is forced. Pin numbers in parenthesis apply to the TEA1098H. Pin numbers not in parenthesis apply to the TEA1098TV.
Fig.12 Decision logic.
1999 Oct 14
16
Philips Semiconductors
Product specification
Speech and handsfree IC
Table 1 < -180 0 > 180 TEA1098 modes MODE Tx mode Idle mode Rx mode
TEA1098
of the transmit and the receive channels so that the sum of both is held constant. In Tx mode, the microphone amplifier is at maximum gain and the loudspeaker amplifier is at minimum gain. In Rx mode, their gains are the opposite. In Idle mode, both microphone and loudspeaker amplifiers are midway between maximum and minimum gain. The difference between the maximum and minimum gain is called the switching range. This range is determined by the ratio of resistors RSWR to RSTAB and is adjustable between 0 and 52 dB. Resistor RSTAB should be 3.65 k which sets an internally used reference current. In the basic application diagram (Fig.19), resistor RSWR is 365 k which results in a switching range of 40 dB. The switch-over behaviour is illustrated in Fig.14. In Rx mode, the gain of the loudspeaker amplifier can be reduced using the volume control. At the same time, the gain of the microphone amplifier increases, since the voice switch keeps the sum of the gains constant (see dashed curves in Fig.14). However, in Tx mode, the volume control has no effect on the gains of the microphone or loudspeaker amplifiers. Consequently, the switching range is reduced when the volume is reduced. At maximum reduction of volume, the switching range is 0 dB.
VSWT - VIDT (mV)
The switch-over timing can be set by capacitor CSWT and the Idle mode timing can be set by capacitor CSWT and resistor RIDT. In the basic application given in Fig.19, CSWT is 220 nF and RIDT is 2.2 M. This enables a switch-over time from Tx to Rx mode or vice-versa of approximately 13 ms (580 mV swing on pin SWT). The switch-over time from Idle mode to Tx or Rx mode is approximately 4 ms (180 mV swing on pin SWT). The switch-over time, from Rx or Tx mode to Idle mode is equal to 4 x RIDTCSWT and is approximately 2 seconds (Idle mode time). The DLC input overrides the decision logic. When the voltage on pin DLC falls below 0.2 V, the capacitor CSWT is discharged by 10 A which selects Tx mode.
Voice switch: pins STAB and SWR
Figure 13 is a diagram of the voice switch. With a voltage on pin SWT, the TEA1098 voice switch regulates the gains
halfpage
DUPLEX CONTROLLER to microphone amplifier from SWT
handbook, halfpage
idle mode
MGM305
Tx mode Gvtx, Gvrx (10 dB/div)
Rx mode RVOL () 11400 7600 3800 0 0 3800 7600 11400
Gvtx
Gvtx + Gvrx = C(1) VOICE SWITCH
STAB SWR
24 (21) 25 (22)
RSTAB RSWR
from volume control
to loudspeaker amplifier
MGL346
Gvrx -400 -200 0 +200 +400
(1) C = constant. Pin numbers in parenthesis apply to the TEA1098H. Pin numbers not in parenthesis apply to the TEA1098TV.
VSWT - VIDT (mV)
Fig.13 Voice switch.
Fig.14 Switch-over behaviour.
1999 Oct 14
17
Philips Semiconductors
Product specification
Speech and handsfree IC
Logic inputs Table 2 Selection of transmit and receive channels for 5 different application modes LOGIC INPUTS FEATURES PD 0 1 1 1 1 HFC X 0 0 1 1 MUTE X 0 1 0 1 DTMF to LN; DTMF to RECO; QR and MICS are active MICS to LN; IR to RECO; QR and MICS are active DTMF to LN; DTMF to RECO; HFRX to LSAO; QR and MICS are active TXIN to TXOUT; HFTX to LN; IR to RECO; HFRX to LSAO; MICS is active
TEA1098
APPLICATION EXAMPLES flash, DC dialling DTMF dialling in handset mode handset conversation DTMF dialling in handsfree handsfree conversation mode
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); all DC levels are referenced to GND. SYMBOL VLN PARAMETER positive continuous line voltage repetitive line voltage during switch-on or line interruption Vn(max) Iline Ptot maximum voltage on pins REG, SLPE, IR and AGC maximum voltage on all other pins except VDD maximum line current total power dissipation TEA1098TV (see Fig.15) TEA1098H (see Fig.16) TEA1098UH; note 1 Tstg Tamb Tj Note 1. Mostly dependent on the maximum required ambient temperature, on the voltage between LN and SLPE and on the thermal resistance between die ambient temperature. This thermal resistance depends on the application board layout and on the materials used. Figure 17 shows the safe operating area versus this thermal resistance for ambient temperature Tamb = 75 C IC storage temperature ambient temperature junction temperature Tamb = 75 C - - - -40 -25 - 400 720 - +125 +75 125 C C C mW mW CONDITIONS MIN. -0.4 -0.4 -0.4 -0.4 - MAX. +12 +13.2 V V UNIT
VLN + 0.4 V VBB + 0.4 V 130 mA
1999 Oct 14
18
Philips Semiconductors
Product specification
Speech and handsfree IC
TEA1098
handbook, full pagewidth
160 Iline (mA)
FCA028
120
(1) (2) (3) (4)
80
(5) (6)
40
0 3.5
5.5
7.5
9.5
11.5
VSLPE (V)
13.5
LINE (1) (2) (3) (4) (5) (6) Fig.15 Safe operating area (TEA1098TV).
Tamb (C) 25 35 45 55 65 75
Ptot (mW) 800 720 640 560 480 400
THERMAL CHARACTERISTICS SYMBOL Rth(j-a) TEA1098TV TEA1098H TEA1098UH PARAMETER thermal resistance from junction to ambient CONDITIONS in free air 115 63 tbf by customer in application K/W K/W VALUE UNIT
1999 Oct 14
19
Philips Semiconductors
Product specification
Speech and handsfree IC
TEA1098
handbook, full pagewidth
160
FCA029
Iline (mA) 120
(1) (2)
(3)
(4)
80
(5)
40
0 3 4 5 6 7 8 9 10 11 VSLPE (V) 12
LINE (1) (2) (3) (4) (5) Fig.16 Safe operating area (TEA1098H).
Tamb (C) 35 45 55 65 75
Ptot (mW) 1304 1158 1012 866 720
1999 Oct 14
20
Philips Semiconductors
Product specification
Speech and handsfree IC
TEA1098
handbook, full pagewidth
160
FCA079
Iline (mA)
(1)
120
(2)
(3)
80
(4) (5) (6) (7)
40
0 2 4 6 8 10 VSLPE (V) 12
LINE (1) (2) (3) (4) (5) (6) (7) Fig.17 Safe operating area at Tamb = 75 C (TEA1098UH).
Rth(j-a) (K/W) 40 50 60 75 90 105 130
1999 Oct 14
21
Philips Semiconductors
Product specification
Speech and handsfree IC
TEA1098
CHARACTERISTICS Iline = 15 mA; RSLPE = 20 ; Zline = 600 ; f = 1 kHz; Tamb = 25 C for TEA1098H and TEA1098TV; Tj = 25 C for TEA1098UH; AGC pin connected to LN; PD = HIGH; HFC = LOW; MUTE = HIGH; measured according to test circuits; all DC levels are referenced to GND; unless otherwise specified. SYMBOL Supplies LINE INTERFACE AND INTERNAL SUPPLY (PINS LN, SLPE, REG AND VBB) VSLPE VBB Iline VSLPE(T) VBB(T) IBB VLN stabilized voltage between SLPE and GND regulated supply voltage for internal circuitry line current for voltage increase Iline = 15 mA Iline = 70 mA Iline = 15 mA Iline = 70 mA start current stop current stabilized voltage variation with Tamb = -25 to +75 C temperature referenced to 25 C regulated voltage variation with Tamb = -25 to +75 C temperature referenced to 25 C current available on pin VBB line voltage in speech mode in handsfree mode Iline = 1 mA Iline = 4 mA Iline = 15 mA Iline = 130 mA SUPPLY FOR PERIPHERALS (PIN VDD) VDD regulated supply voltage on VDD VBB > 3.35 V + 0.25 V (typ.) otherwise VDD(T) regulated voltage variation with Tamb = -25 to +75 C; temperature referenced to 25 C VBB > 3.35 V + 0.25 V (typ.) current consumption on VDD in trickle mode; Iline = 0 mA; VDD = 1.5 V; VBB discharging VDD > 3.35 V IDD(o) VMICS IMICS VIL VIH IPD current available for peripherals VDD = 3.35 V SUPPLY FOR MICROPHONE (PIN MICS) supply voltage for a microphone current available on MICS (PIN PD) -0.4 1.8 - - - -3 +0.3 -6 V A VBB + 0.4 V - - 2.0 - - -1 V mA 3.1 - - 3.35 3.6 V V mV 3.4 5.7 2.75 4.9 - - - - - - - - 3.7 - 3.7 6.1 3.0 5.3 18 45 60 30 11 9 1.55 2.35 4.0 8.7 4 6.5 3.25 5.7 - - - - - - - - 4.3 9.5 V V V V mA mA mV mV mA mA V V V V PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VBB - 0.25 - 30 -
IDD
-
15
150
nA
60 -
100 -3
- -
A mA
POWER-DOWN INPUT
LOW-level input voltage HIGH-level input voltage input current
1999 Oct 14
22
Philips Semiconductors
Product specification
Speech and handsfree IC
TEA1098
SYMBOL IBB(PD)
PARAMETER current consumption on VBB during power-down phase
CONDITIONS PD = LOW
MIN. -
TYP. 460 -
MAX.
UNIT A
Preamplifier inputs (pins MIC+, MIC-, IR, DTMF, TXIN, HFTX and HFRX) Zi(MIC) input impedance differential between pins MIC+ and MIC- single-ended between pins MIC+/MIC- and GNDTX Zi(IR) Zi(DTMF) Zi(TXIN) Zi(HFTX) Zi(HFRX) TX amplifiers TX HANDSET MICROPHONE AMPLIFIER (PINS MIC+, MIC- AND LN) Gv(MIC-LN) Gv(f) Gv(T) CMRR THD voltage gain from pin MIC+/MIC- to LN gain variation with frequency referenced to 1 kHz gain variation with temperature referenced to 25 C common mode rejection ratio total harmonic distortion at LN VLN = 1.4 V (RMS) Iline = 4 mA; VLN = 0.12 V (RMS) Vno(LN) noise output voltage at pin LN; pins MIC+/MIC- shorted through 200 gain reduction if not activated VMIC = 5 mV (RMS) f = 300 to 3400 Hz Tamb = -25 to +75 C 43.3 - - - - - 44.3 0.25 0.25 80 - - -77.5 45.3 - - - 2 10 - dB dB dB dB % % dBmp input impedance between pins IR and LN input impedance between pins DTMF and GND input impedance between pins TXIN and GNDTX input impedance between pins HFTX and GND input impedance between pins HFRX and GND - - - - - - - 70 35 20 20 20 20 20 - - - - - - - k k k k k k k
psophometrically weighted - (p53 curve) see Table 2 60
Gv(mute) Gv(DTMF-LN) Gv(f) Gv(T) Gv(mute)
80
- 26.35 - - -
dB
DTMF AMPLIFIER (PINS DTMF, LN AND RECO) voltage gain from pin DTMF to LN gain variation with frequency referenced to 1 kHz gain variation with temperature referenced to 25 C gain reduction if not activated VDTMF = 50 mV (RMS) f = 300 to 3400 Hz Tamb = -25 to +75 C see Table 2 24.35 25.35 - - 60 0.25 0.25 80 dB dB dB dB
1999 Oct 14
23
Philips Semiconductors
Product specification
Speech and handsfree IC
TEA1098
SYMBOL Gv(DTMF-RECO)
PARAMETER voltage gain from pin DTMF to RECO
CONDITIONS VDTMF = 50 mV (RMS)
MIN. -
TYP. -16.5 -
MAX.
UNIT dB
TX AMPLIFIER USING HFTX (PINS HFTX AND LN) Gv(HFTX-LN) Gv(f) Gv(T) THD VHFTX(rms) Vno(LN) voltage gain from pin HFTX to LN gain variation with frequency referenced to 1 kHz gain variation with temperature referenced to 25 C total harmonic distortion at LN VHFTX = 15 mV (RMS) f = 300 to 3400 Hz Tamb = -25 to +75 C VLN = 1.4 V (RMS) 33.5 - - - - 34.7 0.25 0.25 - 95 -77.5 35.9 - - 2 - - dB dB dB % mV dBmp
maximum input voltage at HFTX Iline = 70 mA; THD = 2% (RMS value) noise output voltage at pin LN; pin HFTX shorted to GND through 200 in series with 10 F gain reduction if not activated
psophometrically weighted - (p53 curve)
Gv(mute) RX amplifiers
see Table 2
60
80
-
dB
RX AMPLIFIERS USING IR (PINS IR AND RECO) Gv(IR-RECO) Gv(f) Gv(T) VIR(rms)(max) voltage gain from pin IR (referenced to LN) to RECO gain variation with frequency referenced to 1 kHz gain variation with temperature referenced to 25 C maximum input voltage on IR (referenced to LN) (RMS value) VIR = 8 mV (RMS) f = 300 to 3400 Hz Tamb = -25 to +75 C Iline = 70 mA; THD = 2% THD = 2% 28.7 - - - 0.75 29.7 0.25 0.3 50 0.9 -88 30.7 - - - - - dB dB dB mV V dBVp
VRECO(rms)(max) maximum output voltage on RECO (RMS value) Vno(RECO)(rms) noise output voltage at pin RECO; pin IR is an open-circuit (RMS value) gain reduction if not activated
psophometrically weighted - (p53 curve) see Table 2 60 -3 sine wave drive; RL = 150 ; THD < 2% 0.75
Gv(mute) Gv(RECO-QR) VQR(rms)(max) Vno(QR)(rms)
80 - 0.9 -88
- +15 - -
dB
RX EARPIECE AMPLIFIER (PINS GARX AND QR) gain voltage range between pins RECO and QR maximum output voltage on QR (RMS value) noise output voltage at pin QR; pin IR is an open-circuit (RMS value) dB V dBVp
Gv(QR) = 0 dB; - psophometrically weighted (p53 curve)
1999 Oct 14
24
Philips Semiconductors
Product specification
Speech and handsfree IC
TEA1098
SYMBOL Gv(trx)
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Automatic Gain Control (pin AGC) gain control range for transmit and receive amplifiers affected by the AGC; with respect to Iline = 15 mA highest line current for maximum gain lowest line current for maximum gain Iline = 70 mA; Gv(MIC-LN); Gv(IR-RECO) 5.45 6.45 6.8 23 57 7.45 7.8 - - dB dB mA mA
Iline = 70 mA for Gv(HFTX-LN) 5.8 - -
Istart Istop
Logic inputs (pins HFC and MUTE) VIL VIH Ii LOW-level input voltage HIGH-level input voltage input current for pin HFC for pin MUTE Handsfree mode (HFC = HIGH) HF MICROPHONE AMPLIFIER (PINS TXIN, TXOUT AND GATX) Gv(TXIN-TXOUT) Gv Gv(f) Gv(T) Vno(TXOUT)(rms) voltage gain from pin TXIN to TXOUT voltage gain adjustment with RGATX gain variation with frequency referenced to 1 kHz gain variation with temperature referenced to 25 C noise output voltage at pin TXOUT; pin TXIN is shorted through 200 in series with 10 F to GNDTX (RMS value) gain reduction if not activated f = 300 to 3400 Hz Tamb = -25 to +75 C VTXIN = 3 mV (RMS); RGATX = 30.1 k 12.7 -15 - - 15.2 - 0.1 0.15 -101 17.7 +16 - - - dB dB dB dB dBmp VBB = 3.0 V - - 3 -3 6 -12 A A -0.4 1.8 - - +0.3 V VBB + 0.4 V
psophometrically weighted - (p53 curve)
Gv(mute) Gv(HFRX-LSAO)
see Table 2
60
80
- 30.5
dB
HF LOUDSPEAKER AMPLIFIER (PINS HFRX, LSAO, GALS AND VOL) voltage gain from pin HFRX to LSAO voltage gain adjustment with RGALS gain variation with frequency referenced to 1 kHz gain variation with temperature referenced to 25 C voltage gain variation related to RVOL = 1.9 kW f = 300 to 3400 Hz Tamb = -25 to +75 C when total attenuation does not exceed the switching range VHFRX = 30 mV (RMS); RGALS = 255 k; Iline = 70 mA 25.5 28 dB
Gv Gv(f) Gv(T) Gv(vol)
-28 - - -
- 0.3 0.3 -3
+7 - - -
dB dB dB dB
1999 Oct 14
25
Philips Semiconductors
Product specification
Speech and handsfree IC
TEA1098
SYMBOL
PARAMETER
CONDITIONS Iline = 70 mA; RGALS = 33 k; for 2% THD in the input stage
MIN. -
TYP. 580 -
MAX.
UNIT mV
VHFRX(rms)(max) maximum input voltage at pin HFRX (RMS value) Vno(LSAO)(rms) noise output voltage at pin LSAO; pin HFRX is open-circuit (RMS value) gain reduction if not activated output voltage (RMS value)
psophometrically weighted - (p53 curve) see Table 2 IBB = 0 mA; IDD = 1 mA Iline = 18 mA Iline = 30 mA Iline > 50 mA - - - 150 60
-79
-
dBVp
Gv(mute) VLSAO(rms)
80 0.9 1.3 1.6 300
- - - - -
dB V V V mA
ILSAO(max)
maximum output current at pin LSAO (peak value)
DYNAMIC LIMITER (PINS LSAO AND DLC) tatt attack time when VHFRX jumps from 20 to 20 mV + 10 dB when VBB jumps below VBB(th) trel THD VBB(th) VDLC(th) release time total harmonic distortion VBB limiter threshold threshold voltage required on pin DLC to obtain mute receive condition threshold current sourced by pin VDLC = 0.2 V DLC in mute receive condition voltage gain reduction in mute receive condition VDLC = 0.2 V when VHFRX jumps from 20 mV + 10 dB to 20 mV VHFRX = 20 mV + 10 dB; t > tatt - - - - - -0.4 - 1 100 1 2.7 - 5 - - 2 - +0.2 ms ms ms % V
MUTE RECEIVE (PIN DLC) V
IDLC(th) Gvrx(mute)
- 60
100 80
- -
A dB
TX AND RX ENVELOPE AND NOISE DETECTORS (PINS TSEN, TENV, TNOI, RSEN, RENV AND RNOI)
Preamplifiers
Gv(TSEN) Gv(RSEN) voltage gain from pin TXIN to TSEN voltage gain from pin HFRX to RSEN sensitivity detection on pin ITSEN = 0.8 to 160 A TSEN; voltage change on pin TENV when doubling the current from TSEN - - 40 0 - - dB dB
Logarithmic compressor and sensitivity adjustment
Vdet(TSEN) - 18 - mV
1999 Oct 14
26
Philips Semiconductors
Product specification
Speech and handsfree IC
TEA1098
SYMBOL Vdet(RSEN)
PARAMETER sensitivity detection on pin RSEN; voltage change on pin RENV when doubling the current from RSEN
CONDITIONS IRSEN = 0.8 to 160 A
MIN. - 18
TYP. -
MAX.
UNIT mV
Signal envelope detectors
Isource(ENV) Isink(ENV) VENV maximum current sourced from pin TENV or RENV maximum current sunk by pin TENV or RENV voltage difference between pins RENV and TENV when 10 A is sourced from both RSEN and TSEN; signal detectors tracking; note 1 - 120 - -0.75 - A A mV
-1.25 -1 - 3
Noise envelope detectors
Isource(NOI) Isink(NOI) VNOI maximum current sourced from pin TNOI or RNOI maximum current sunk by pin TNOI or RNOI voltage difference between pins RNOI and TNOI 0.75 - when 5 A is sourced from - both RSEN and TSEN; noise detectors tracking; note 1 - 1 -120 3 1.25 - - A A mV
DIAL TONE DETECTOR VHFRX(th)(rms) threshold level at pin HFRX (RMS value) RRSEN = 10 k 25 - mV
TX LEVEL LIMITER VTXIN(th)(rms) threshold level at pin TXIN (RMS value) RTSEN = 10 k - 0.75 - mV
DECISION LOGIC (PINS IDT AND SWT)
Signal recognition
VSrx(th) threshold voltage between pins RENV and RNOI to switch-over from receive to Idle mode threshold voltage between pins TENV and TNOI to switch-over from transmit to Idle mode VHFRX < VHFRX(th); note 2 - 13 - mV
VStx(th)
VTXIN < VTXIN(th); note 2
-
13
-
mV
Switch-over
Isource(SWT) Isink(SWT) Iidle(SWT) current sourced from pin SWT when switching to receive mode current sunk by pin SWT when switching to transmit mode current sourced from pin SWT in Idle mode 7.5 10 12.5 -7.5 - A A A
-12.5 -10 - 0
1999 Oct 14
27
Philips Semiconductors
Product specification
Speech and handsfree IC
TEA1098
SYMBOL
PARAMETER
CONDITIONS
MIN. -
TYP. -
MAX.
UNIT
VOICE SWITCH (PINS STAB AND SWR) SWRA SWRA Gv switching range switching range adjustment voltage gain variation from transmit or receive mode to Idle mode gain tracking (Gvtx + Gvrx) during switching, referenced to Idle mode with RSWR referenced to 365 k 40 - 20 dB dB dB -40 - +12 -
Gtr
-
0.5
-
dB
Notes 1. Corresponds to 1 dB tracking. 2. Corresponds to 4.3 dB noise/speech recognition level.
1999 Oct 14
28
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
book, full pagewidth
1999 Oct 14 29
TEST AND APPLICATION INFORMATION
Philips Semiconductors
Speech and handsfree IC
Zexch 600
i = 15 mA J_line Dz Vd = 10 V Cemc 10 nF
Zimp 620
VIR
RSLPE 20
CREG 4.7 F
CVBB 470 F AGC LN VBB 13 (10)
CVDD 47 F VDD 22 (19)
SLPE 17 (14) CIR 100 nF CMICS 4.7 F MICS MIC+ RMIC 200 MIC- 23 (20) 34 (31)
REG 19 (16)
21 (18) 18 (15)
100 F
Cexch
100 F
Cimp
IR
20 (17) (38) 1 (37) 40 (39) 2
PD HFC MUTE
(33) 36
QR CGAR 100 pF Re2 100 k RQR
VMIC
33 (30)
(34) 37
GARX Re1
150 CQR 4.7 F
CGARS 1 nF Crxe
CHFTX 100 nF
HFTX
39 (36)
100 k RECO 100 nF CHFRX (1) 5 HFRX 100 nF
TXOUT RGATX 30.1 k GATX CTXIN VHFTX 100 nF CDTMF VTXIN 100 nF DTMF
TEA1098
29 (26)
(35) 38
VHFRX
30 (27) (11) 14 31 (28) RGALS 255 k 35 (32) (12) 15 (6) 10 8 (4) (7) 11 7 (3) (5) 9 (25) 28 27 (24) LSAO CGALS 150 pF GALS
TXIN
RSEN RENV RNOI IDT RIDT 2.2 M CRNOI 4.7 F RRSEN 10 k CRENV 470 nF
CLSAO 220 F RLSAO 50
TSEN
VDTMF
TENV TNOI RTSEN 10 k CTSEN 100 nF CTENV 470 nF
6 (2) 16 (13)
32 (29)
24 (21)
25 (22)
26 (23)
12 (8)
GND CTNOI 4.7 F
GNDTX
STAB RSTAB 3.65 k
SWR RSWR 365 k
VOL RVOL 0 to 22 k
DLC CDLC 470 nF
SWT CSWT 220 nF
CRSEN 100 nF
Product specification
TEA1098
MGL440
Pin numbers in parenthesis apply to the TEA1098H. Pin numbers not in parenthesis apply to the TEA1098TV.
Fig.18 Test configuration.
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
dbook, full pagewidth
1999 Oct 14
D2 D3 Dz Vd = 10 V Cemc 10 nF Zimp 620 Cimp 22 F MICS RMICP 1 k Ctx2 handset micro CMICH 33 nF 22 nF Ctx1 A B 22 nF RMICM 1 k from MICS RBMICS 2 k handsfree micro CMICB 22 nF
Philips Semiconductors
Speech and handsfree IC
Rbal2 820 Rbal1 130 Rast2 3.92 k
Cbal 220 nF RSLPE 20 Rast3 392 CIR 100 nF IR SLPE
17 (14) 20 (17)
CREG 4.7 F
CVBB 470 F AGC LN
18 (15)
CVDD 47 F VDD
22 (19) (38) 1 (37) 40 (39) 2
REG
19 (16)
VBB
13 (10)
21 (18)
PD HFC MUTE QR CGAR 100 pF Re1 100 k RECO Crxe 100 nF CHFRX 100 nF from microcontroller CQR 10 F Re2 100 k CGARS 1 nF
Rast1 130 k
MICS CMICS 10 F MIC+ Rtx3 8.2 k
23 (20) (33) 36
Rtx2 15 k Rtx1
34 (31) (34) 37
GARX
MIC-
33 (30)
15 k CHFTX 100 nF
HFTX TXOUT
39 (36)
(35) 38
TEA1098
29 (26) (1) 5
30
D1 D4
RGATX 30.1 k CTXIN 100 nF CDTMF 100 nF
HFRX GALS
GATX TXIN
30 (27) 31 (28)
(11) 14
DTMF
(12) 15 35 (32) (6) 10
RGALS 255 k LSAO RSEN RENV RNOI IDT RIDT 2.2 M
CGALS 150 pF
CLSAO 220 F
TSEN TENV TNOI
RTSEN 10 k CTSEN 100 nF CTENV 470 nF
8 (4) 7 (3) 6 (2) 16 (13) 32 (29) 24 (21) 25 (22) 26 (23) 12 (8)
(7) 11 (5) 9 (25) 28 27 (24)
GND
CTNOI 4.7 F
GNDTX
STAB
RSTAB 3.65 k
SWR
RSWR 365 k
VOL
RVOL 0 to 22 k
DLC
CDLC 470 nF
SWT
CSWT 220 nF
RRSEN 10 k CRNOI 4.7 F CRENV 470 nF CRSEN 100 nF
Product specification
MGL316
TEA1098
Pin numbers in parenthesis apply to the TEA1098H. Pin numbers not in parenthesis apply to the TEA1098TV.
Fig.19 Basic application diagram.
Philips Semiconductors
Product specification
Speech and handsfree IC
BONDING PAD LOCATIONS FOR TEA1098UH All x/y coordinates represent the position of the centre of the pad (in m) with respect to the origin (x/y = 0/0) of the die (see Fig.20). The size of all pads is 80 m2. COORDINATES SYMBOL HFRX TNOI TENV TSEN RNOI RSEN RENV DLC n.c. VBB GALS LSAO n.c. GND GND SLPE LN REG IR AGC VDD MICS PAD X 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 81.5 81.5 81.5 81.5 81.5 81.5 81.8 81.5 81.5 81.5 81.5 129.2 345.2 805.5 1069 1299.2 1488.5 1648.8 1832.8 2028 2195 2393.5 Y 3597.5 3402.2 3187 2964.2 2746 2511.8 2282.8 1972.8 1499.8 1023 589.5 100.8 100.8 100.8 100.8 100.8 100.8 100.8 100.8 100.8 101 101.5 SYMBOL STAB SWR VOL SWT IDT TXOUT GATX TXIN GNDTX GNDTX MIC- MIC+ DTMF QR GARX RECO HFTX HFC PD MUTE n.c. n.c. n.c. n.c. n.c. PAD X 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 2586.5 2778.8 2969 2969 2969 2969 2969 2969 2969 2968.8 2968.8 2968.5 2968.5 2968.5 2890 2572 2290.8 2051.8 1798.2 1544.8 1296.8 861 657.2 459.5 255
TEA1098
COORDINATES Y 101.5 101.5 144 379.8 681.5 1086 1342.2 1961.2 2152 2344.2 2522.8 2837.2 3062.5 3499.8 3712.8 3712.8 3712.8 3712.8 3712.8 3712.8 3712.8 3712.8 3712.8 3712.8 3712.8
1999 Oct 14
31
Philips Semiconductors
Product specification
Speech and handsfree IC
TEA1098
handbook, halfpage
1 2 3 4 5 6 7 8
47 46 45 44
43 42 41 40 39
38
37 36 35 34
TEA1098UH
R6621R
33 32 31 30
9
Die Identifier
29 10 28 27 26
11
x 0
12 13 14 15 16 17 18 19 20 21 22 23 24
25
0
y
FCA078
Fig.20 TEA1098UH bonding pad locations.
1999 Oct 14
32
Philips Semiconductors
Product specification
Speech and handsfree IC
PACKAGE OUTLINES VSO40: plastic very small outline package; 40 leads
TEA1098
SOT158-1
D
E
A X
c y HE vMA
Z 40 21
Q A2 A1 pin 1 index Lp L 1 e bp 20 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Notes 1. Plastic or metal protrusions of 0.4 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT158-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION A max. 2.70 0.11 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 bp 0.42 0.30 c 0.22 0.14 D (1) 15.6 15.2 E (2) 7.6 7.5 0.30 0.29 e 0.762 0.03 HE 12.3 11.8 0.48 0.46 L 2.25 Lp 1.7 1.5 Q 1.15 1.05 v 0.2 w 0.1 y 0.1 Z (1) 0.6 0.3
0.012 0.096 0.017 0.0087 0.61 0.010 0.004 0.089 0.012 0.0055 0.60
0.067 0.089 0.059
0.045 0.024 0.008 0.004 0.004 0.041 0.012
7 0o
o
ISSUE DATE 92-11-17 95-01-24
1999 Oct 14
33
Philips Semiconductors
Product specification
Speech and handsfree IC
TEA1098
QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm
SOT307-2
c
y X
A 33 34 23 22 ZE
e E HE wM bp pin 1 index 44 1 bp D HD wM 11 ZD B vM B vMA 12 detail X A A2 (A 3) Lp L
A1
e
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.10 A1 0.25 0.05 A2 1.85 1.65 A3 0.25 bp 0.40 0.20 c 0.25 0.14 D (1) 10.1 9.9 E (1) 10.1 9.9 e 0.8 HD 12.9 12.3 HE 12.9 12.3 L 1.3 Lp 0.95 0.55 v 0.15 w 0.15 y 0.1 Z D (1) Z E (1) 1.2 0.8 1.2 0.8 10 0o
o
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT307-2 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-02-04 97-08-01
1999 Oct 14
34
Philips Semiconductors
Product specification
Speech and handsfree IC
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.
TEA1098
* For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1999 Oct 14
35
Philips Semiconductors
Product specification
Speech and handsfree IC
Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, LFBGA, SQFP, TFBGA HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable not not not suitable(1) recommended(3)(4) recommended(5) suitable suitable suitable suitable suitable suitable
TEA1098
REFLOW(1)
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
1999 Oct 14
36
Philips Semiconductors
Product specification
Speech and handsfree IC
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TEA1098
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. BARE DIE DISCLAIMER All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. There is no post waffle pack testing performed on individual die. Although the most modern processes are utilized for wafer sawing and die pick and place into waffle pack carriers, Philips Semiconductors has no control of third party procedures in the handling, packing or assembly of the die. Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in which the die is used.
1999 Oct 14
37
Philips Semiconductors
Product specification
Speech and handsfree IC
NOTES
TEA1098
1999 Oct 14
38
Philips Semiconductors
Product specification
Speech and handsfree IC
NOTES
TEA1098
1999 Oct 14
39
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 68
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
465002/04/pp40
Date of release: 1999
Oct 14
Document order number:
9397 750 06403

▲Up To Search▲

Price & Availability of TEA1098

	To Download TEA1098 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .